COG ɔ COB: Fɔ pik wan Smɔl LCD

Atikul

Ɔktoba 13, 2022

Drayva IC dɛn na smɔl LCD dɛn kin ataya insay tu men we dɛn. Di difrɛns de rɔn ɔl di we tru to tik, vaybreshɔn tolɛreshɔn, humidity tolɛreshɔn, asɛmbli ɛn riparaybiliti.

Fɔs, Usay di Tu Strukchɔ dɛn Difrɛn

Smɔl LCD drayva IC dɛn de ataya insay tu men we dɛn. COG (chip-on-glass) de bon di IC dairekt to di edj fɔ di glas, so di mɔdyul rili tin ɛn di rɔn frɔm IC to glas trays shɔt, we de alaw fɔ tray fɔ rili fayn. COB (chip-on-board) de put di IC pan di PCB, waya-bonded ɛn afta dat i kapsul wit ɛpoksi, strɔkchɔral wan nia wan kɔvɛnshɔnal bod.

Dat difrεns de prכpagεt tru evritin dכwnstrim: tik, vaybrεshכn tכlerεns, humidity tכlerεns, assembly εn riparaybiliti כl fכk ya. COG ɛn COB nɔto advans versus ɔbsolɛt; dɛn na tu difrɛn tɛknikal rod dɛn, ɛn ɛni wan pan dɛn fit fɔ difrɛn opareshɔn kɔndishɔn dɛn. Pik di rɔng rod ɛn no amɔnt ɔf prɔses tuning nɔ de rikavari am.

Di Strɔng ɛn Bɔnda dɛn we COG gɛt

Di advantej we COG gɛt we pɔsin kin si pas ɔl na we i tan. Modul kin go dɔŋ tu milimita, di glas edj de autput dairekt, intakɔnekt rɔn dɛn shɔt ɛn ilɛktromagnetik intafɛreshɔn smɔl. 1602 karakta fɔmat ɛn 122x32 to 240x128 grafik fɔmat dɛn ɔl machɔ, wit bɔku bɔku glas ɛn drayva dɛn we yu kin pik. Ɛni prɔdak we sɛnsitiv to tik ɛn wet — ɔlta-tin rimot kɔntrol, wearables, kɔmpakt panɛl — gɛt COG as di difɔlt ansa.

Dɛn fɔ tɔk klia wan bɔt di bɔda dɛn we i gɛt. Di IC de bon dairekt to di glas, so glas-edj strɛs, bɛnd we dɛn de asembli ɛn shɔk we dɛn de transpɔt ɔl kin afɛkt rilaybiliti, ɛn di asɛmbli prɔses de aks fɔ mɔ prɛsishɔn. Di sil bɔda na sɛnsitiv to mɔstɔ, so rilaybiliti insay lɔng tɛm ay-humiditi ɛnvayrɔmɛnt nid dediket dizayn. In shot, COG na padi to tin ɛn layt; i nɔ kin mek padi fayn to rɔf savis.

COB in Strɔng ɛn Bɔnda dɛn

COB na di ɔpɔzit. Di drayva IC sidɔm pan di PCB, waya-bɔnd ɛn afta dat ipoksi-ɛnkapsul as a ɔl, we de gi klia wan bɛtɛ vaybreshɔn ɛn humiditi tolɛreshɔn, ay asɛmbli tolɛreshɔn, ɛn bod-lɛvel ripa we sɔntin nɔ wok. Di sapɔt chen machɔ ɛn di kɔst kin ɔltɛm smɔl. 1602, 2004 te to 320x240 karakta ɛn grafik fɔmat na klas sɔlvishɔn, we dɛn yuz fɔ pas tɛn ia insay industrial inschrumɛnt ɛn aplayans.

COB in bɔda na volyum. Fɔ put di IC na di PCB min se di mɔdyul fɔ lɛf rum fɔ am, so ɔl tu di tik ɛn eria de rayz, ɛn fɔ swɛt am insay tu ɔ tri milimita spɛs na essentially impossible. Di induktans fɔ bond waya dɛn bak nɔ fayn pas COG in dairekt bond ɔnda ay-frikyuɛnsi drayvin, we de mek i sab-ɔptimal fɔ ay-rɛzolushɔn, ay-rifresh dizayn dɛn. Tin ɛn ɔpreshɔn kɔndishɔn — di tred-ɔf sidɔm na da ɛkshɛnj de.

Tri Mɛzhɔ, ɛn Ɔl tu di Rot dɛn De Opin

Praktikal sɛlɛkshɔn kin kam dɔŋ to tri kwɛstyɔn dɛn. Fɔs: usay dis skrin de go, ɛn ɔmɔs milimita de fɔ am — di ansa de disayd if COG pɔsibul. Sɛkɔn: wetin na di opareshɔn ɛnvayrɔmɛnt, i go vaybrɛt, aw i humid, i go ripɛnt — di ansa de disayd if dɛn nid COB. Tɔd: kɔst ɛn kapasiti — ɔl tu machɔ, so dis nɔ kin rili disayd.

We dɛn ansa dɛn tri de, bɔku tɛm di rod kin klia. Di nɔ-standad rimɛnd kin divɛlɔp fɔ wan ɔda: dɛn kin divɛlɔp nɔ-standad inch saiz ɛn rizɔlt, ɛn intafɛs, lɔjik vɔlɔt, we fɔ si di dairekshɔn, FPC lɔng ɛn pin difinishɔn dɛn ɔl kin ajɔst to di dizayn. Wi gɛt machɔ COG ɛn COB sɔlvishɔn dɛn ɔl tu; sɔbmit di kɔntinyu, dimɛnshɔn ɛn ɔpreshɔn kɔndishɔn ɛn wan sɔlv ɛn kot kam bak insay twɛnti-fo awa. Selekshɔn nɔto fɔ pik wan prɔdak; na fɔ pik wan rod we go mach yu divays.

Wan Midul Path: Aw di Mɔdyul Dɛn Kɔnekt

Di COG versus COB argumɛnt kin ɔltɛm freym as teknɔlɔji chuk, bɔt fɔ smɔl divays dɛn di mɔ kɔnsɛkshɔn vɛriɔbul na aw di mɔdyul kɔnɛkt to di ɔs bɔd. COB modul wit pin hεda de fכgiv: dεn kin sכkεt, riples dεm na fil, εn hansכlda pan wan sכt prodakshכn rכn. Di sem modul we de insay zibra-strip ɔ fleksibul tel kɔnfigyushɔn de sev ples bɔt i de mek fil savis nɔ prɛktikal ɛn i de put alaynɛshɔn rikwaymɛnt pan di asɛmbli prɔses. Na fכ כndrεd yunit dεm, wan hεda-bεys mכdule wit sכm big futprin na di lכw-risk chכys bכku tεm.

Di zebra strip asɛmbli dɛn mɔ fɔ gɛt wɔnin. Dɛn kin dipen pan kɔnsistɛns prɛshɔn ɛn klin say dɛn, ɛn haus we de fleks ɔnda tɛmpracha go lɔs kɔntakt wan wan tɛm. If wan zibra dizayn nɔ go ebul fɔ avɔyd, spɛsifa di kɔmpreshɔn rɛnj ɛn tɛst wan ful-asembled yunit tru tɛmpracha sayklin pas di bare modul. Wi de stet di kɔnɛkshɔn we ɛn in mɛkanikal rikwaymɛnt dɛn na di kot so di asɛmbli risk go de bifo dɛn put di ɔda.

Bifo Yu Pik wan Strukchɔ, Aks If Di Skrin Gɛt Ripair

Mɔs pan di COG versus COB dibɛtɛ kin stɔp pan pefɔmɛns kɔmpiashɔn. Di kwɛstyɔn we rili disayd am na di fil, dɛn kin skip am: wetin kin apin we dis skrin nɔ wok. COG de bon di drayva IC to di glas, so if i nɔ wok, dat min se dɛn fɔ riples di wan ol mɔdyul, ɛn nɔ pɔsibul fɔ mek dɛn ripɛnt di fil. COB de kip di drayva na di PCB, so tiori riwok spɛs de pan ɔl we na prɔsis riplesmɛnt na mɔ kɔmɔn.

Prodakt posishun de disayd di ansa komplit. Fɔ wan dispɔzabl kɔshɔma divays wit ekstrim kɔst sɛnsitiviti, di tin we COG tan ɛn sev na kɔrɛkt ɛn ripa nɔ impɔtant. Fɔ di ikwipmɛnt dɛn we de kam insay wan industrial sayt, we dɛn tink se go wok fɔ lɔng lɔng tɛm ɛn we dɛn go riples am na di fil, di chukchuk fɔ tilt to mentenɛns. Dis nɔto tɛknikal ranking, na kɔnsɛkshɔn fɔ di kayn prɔdak.

Smɔl-batch prɔjek dɛn ad wan mɔ tin fɔ tink bɔt: dɛn fɔ analayz di yunit dɛn we nɔ wok di tɛm we dɛn de tray. If di modul nɔ ebul fɔ opin, fayl analisis de stɔp fɔ riples am ɛn dɛn nɔ de gɛt ɛni rut kɔz. Wi de flag dis tred-ɔf na kɔstɔmayshɔn stej so di klaynt no na kot wetin dɛn dɔn pik, pas fɔ diskɔba se no we nɔ de fɔ go bak afta di fayl.

COG Modul Customisation: Segmɛnt Layout, Sayz ɛn Mɔnokrom Grafik

We dɛn dɔn pik COG, di kɔstɔmayshɔn kin apin pan 4 layers, ɛn i kin ɛp fɔ no uswan dɛn nɔ dia. Di glas autlayn ɛn di sɛgmɛnt layout sidɔm pan di mask, so dɛn de tul: wan COG LCD modul kɔstɔm projɛkt de pe fɔ dɛn wan tɛm ɛn afta dat i de yuz dɛn bak fɔ ɛvri yunit. Di drayva IC ɛn di bias skim na wan we yu kin pik frɔm wan fiks mɛnyu. Di FPC na artwok, i chip fɔ rivays na protɔtayp stej ɛn i dia afta tul. Di bezɛl na di wan we smɔl pas ɔl ɛn di wan we di wan dɛn we de bay kin chenj bɔku tɛm.

Wan kɔlɔ grafik LCD we gɛt kɔstɔm saiz na difrɛn animal frɔm sɛgmɛnt panɛl. Na ya di mask de difayn wan piksɛl matris — 128x64, 122x32, 160x128 — ɛn di kɔstɔmayshɔn na di ɔtlayn rawnd am plus di kɔntrol we de drayv am. Di tred-ɔf na dat wan grafik panɛl kin sho ɛni kɔntinyu we di famwɔya drɔ, pan di kɔst fɔ wan kɔntrol ɛn wan font tebul, we wan sɛgmɛnt panɛl kin shɔt fɔ wan yunit ɛn i kin shɔt fa fawe fɔ drayv. Prodak dɛn we de sho di sem aykɔn dɛn fɔ tɛn ia fɔ bi sɛgmɛnt; prodak dɛm we dɛn skrin kɔntinyu go chenj wit famwɔya fɔ bi grafik.