Oktoba 13, 2022
Driver IC ko ilo LCD ko redik rej kobalok ilo ruo wewein ko relap. Oktak eo ej etal ñan joñan depakpak, maroñ in mōkaj, maroñ in mōrā, kobaiktok im maroñ in kōkmmanmanlok.
LCD driver IC ko redik rej kobalok ilo ruo wewein ko relap. COG (chip-on-glass) ej likit IC eo ñan tōrerein glass eo, innem module eo ej lukkun dik im an ettōr jen IC ñan glass traces ej dik, im kōtlok trace ko redik. COB (chip-on-board) ej likit IC eo ion PCB eo, wire-bonded innem encapsulated kin epoxy, epaaklok ñan juon board eo ekkā.
Oktak in ej walok ilo aolep men ko ilo tu-kadu: mōttan, maroñ in mōkaj, maroñ in mōrā, kobaik im maroñ in kōkmman aolep men ko ijin. COG im COB rejjab eddeklok ak rejjab jerbal; rej ruo ial in jerbal ko reoktak jen dron, kajjojo rej ekkar ñan jekjek in jerbal ko reoktak jen dron. Kālet ial eo ebwid im ejelok joñan process tuning ej bar bōktok.
Men eo emman tata an COG ej an mōrā. Module ko remaroñ etal iumin ruo millimetres, tōrerein glass eo ej walok jimwe, interconnect run ko rej dik im electromagnetic interference ej dik. 1602 letter format ko im 122x32 ñan 240x128 graphic format ko rej aolep rūtto, ippāñ elōn kain glass im driver ko. Jabdewōt men eo ej jelet joñan depakpak im eddo — remote control ko redik, kein jerbal ko, compact panel ko — ewōr COG ie einwot uwaak eo.
Boundary ko an rej aikuj in alikar. IC eo ej lukkun kobalok ñan glass eo, innem an glass-edge stress, bending ilo ien assembly im shock ilo ien bōklok remaroñ aolep jelet reliability, im assembly process eo ej aikuji elaplok jimwe. Border in seal eo ej maroñ in bōk molo, innem an maroñ in tiljek ilo jikin ko elap molo ie ej aikuj juon karōk eo ejejjet. Ilo kakobaba, COG ej mōñā ñan mōrā im meram; ejjab lukkun emman ñan jerbal in jipan.
COB ej oktak eo. Driver IC eo ej jijet ion PCB eo, wire-bonded innem epoxy-encapsulated einwot juon men eo elap, ej letok juon wāween eo emmanlok ñan vibration im humidity tolerance, high assembly tolerance, im board-level repair ñe ewōr juon men ej jorrāān. Supply chain eo ej rūttolok im joñan wōnan ej diklok. 1602, 2004 ñan 320x240 letter im graphic format ko rej wāween ko rekāāl, kar kōjerbali iumwin elõñ yio ko ilo kein jerbal ko im kein jerbal ko.
Boundary eo an COB ej volume. Likūt IC eo ioon PCB ej meļeļein bwe module eo ej aikuj in likūt jikin n̄an e, bwe en ļapļo̧k an ļap im jikin, im dāpij e ilo juon jikin ruo ak jilu milimita ej lukkuun jab maron̄. Inductance in bond wire ko ej barāinwōt diklok an emman jen COG's direct bond iumin high-frequency driving, kōmmane bwe en jab emman ñan high-resolution, high-refresh design ko. Mōttan im jekjek in jerbal — wiakake eo ej bed ilo jikin wia eo.
Kālet eo emman ej itok jen jilu kajitok ko. Mokta: ia eo screen in ej etal ñane, im ewi joñan millimeter ko rej bed ñan e — uak eo ej bebe elañe COG emaron in walok. Kein karuo: ta jikin jerbal eo, enaj ke mōkaj an mōkaj, ewi joñan an molo, enaj ke kōkmmanmanlok — uak eo ej bebe elañe COB ej aikuj. Kein kajilu: wōnan im maroñ — jimor rej rūtto, innem men in ejjab lukkun aorōk.
Ilo an kar uwaak kein jilu, ial eo ekkā an alikar. Remainder eo ejjab ekkar emaron in kōmmane ilo juon order: joñan inch ko im resolution ko rejjab ekkar remaroñ in kōmmane, im interface, logic voltage, viewing direction, FPC length im pin definitions remaroñ aolep kōmmane ñan design eo. Ewōr ippād COG im COB ko rerūtto; jilkintok men ko ie, joñan im jekjek in jerbal ko im juon uwaak im quotation enaj bar jeblak ilowaan 24 awa. Kālet ejjab bōk juon men; ej kālet juon ial eo ej ekkar ñan device eo am.
COG nae COB ej ekkā an kōmmane einwot juon kālet in technology, ak ñan device ko redik men eo elaptata an aorōk ej ewi wawein an module eo kone ñan host board eo. COB module ko ippāer pin header ko rej jeorlok bwid: remaroñ in socketed, bōk jikin ilo field eo, im handsoldered ilo juon ien kōmman eo edik. Ejja module eo wot ilo juon zebra-strip ak flexible tail configuration ej kōjparok jikin ak ej kōmman bwe field service en jab jerbal im ej likit aikuj in alignment ilo assembly process eo. Ilo jejjo buki unit ko, juon header-based module ippāñ juon footprint eo elaplok ej ekkā an kālet eo ediklok an jorrāān.
Zebra strip assemblies rej aikuj juon kakkōl. Rej pedped wōt ioon joñan an kajoor im jikin ko rerreo, im juon mweo eo ej mōkaj an mōkaj an bwil im molo enaj jako an maroñ in jerbal ilo ien ko jet. Elañe juon zebra design ejjab maroñ in bōbrae, kwalok joñan compression range eo im test juon unit eo emōj an dedelok ilo temperature cycling jen bare module eo. Jej kwalok kin wewein kōllaajrak eo im aikuj ko an ilo quotation eo bwe en alikar joñan an maroñ in kobalok mokta jen an order eo kōmmane.
Elōñ COG nae COB akwāāl ko rej bōjrak ilo keidi jerbal ko. Kajjitōk eo ej lukkun kōmmane ilo jikin jerbal eo ekkā an likjab: ta eo ej walok ñe screen in ej likjab. COG ej likit driver IC eo ñan glass eo, innem juon jorrāān ej melelen bōk jikin aolepān module eo, im ejelok maroñ in kōkmman ilo field eo. COB ej likit driver eo ilo PCB eo, innem ewōr jikin jerbal ko jet meñe ilo jerbal in bōk jikin ej laplok an walok.
Jikin eo an men eo ej kōmmane ej kōmman bwe en jejjet uwaak eo. Ñan juon kein jerbal eo ej jolok juon alen im elap an wōr wōnan, joñan an dik im joñan an dik wōnan COG ej jimwe im kōkmman ejjab aorōk. Ñan kein jerbal ko rej deloñ ilo juon jikin jerbal, rej kōtmene bwe renaj jerbal iumin elõñ yio ko im renaj bōk jikier ilo jikin jerbal eo, jokālet eo ej aikuj in oktaklok ñan kejbãrok. Menin ejjab juon joñan eo ejejjet, ej juon tokjen in kain men eo.
Project ko redik rej kobaik bar juon men in lemnok: unit ko rejjab jerbal rej aikuj in etale ilo ien trial eo. Elañe module eo ejjab maroñ in bellok, etale in likjab ej bōjrak ilo an bōk jikin im ejelok unin an walok. Jej flag trade-off in ilo ien kōmman bwe client eo en jelā ilo ien quotation ta eo kar kãlete, jen an lo bwe ejelok ial in bar jeblak elikin an kar likjab.
Ñe emoj kālet COG, kōmman eo ej walok ilo emān laajrak ko, im ej jibañ ñan jelā ta ko rej dik wōnāer. Glass outline eo im segment layout eo rej bed ion mask eo, innem rej tooling: juon COG LCD module custom project ej kōllāik ir juon alen innem bar kajerbali ñan kajjojo unit. Driver IC eo im bias scheme eo rej juon kālet jen juon menu eo ejjab oktak. FPC ej juon jerbal in kōmman pija, edik wōnan ñan bar kōmmane ilo ien prototype eo im elap wōnan elikin an kar kōmmane kein jerbal ko. Bezel eo ej men eo edik wōnan im ej men eo ri wia ro rej ukōte elaptata.
Juon LCD eo ewōr an pija ko ilo juon joñan eo ekkar ej juon menin mour eo eoktak jen juon segment panel. Ilo ijin mask eo ej kwalok juon pixel matrix — 128x64, 122x32, 160x128 — im customization eo ej outline eo iturin im controller eo ej kōmmane. Men eo ej walok ej bwe juon graphic panel emaron kwalok jabdrewot men ko firmware eo ej je, ilo wōnan juon controller im juon font table, ilo ien eo juon segment panel ediklok wōnan juon unit im elaplok an dik wōnan drive. Men ko rej kwalok ejja icon ko wōt iumwin joñoul yio ko rej aikuj in segment; men ko rej walok ilo screen eo air enaj oktak kin firmware rej aikuj in graphic.
Kwalok ñan kim jekjek in jerbal eo am im men ko rej aikuji, innem kim naj lewoj juon wāween eo ejimwe im lewoj juon am quote ilowaan 24 awa.
Bōk juon quote ejjelok wōnāānCOG im COB LCD, PMOLED/AMOLED micro-display, 0.69-10.1-inch TFT color screen im LED backlight module, jiljino series im 61 model ko rej kōmmane; joñan eo ejjab ekkar, joñan an alikar, joñan an emman, ia eo ej lale im FPC rej kōmmane ekkar ñan pija ko; joñan bwil im molo eo ekkar, jikin jerbal ko im joñan bwil im molo eo elap jilu-mōkaj in bwil im molo; kar lelok ekkar ñan RoHS, REACH im CE ippāñ peba in kōjparok ko rejejjet, 12-allōñ in warranty emaron in to lak ekkar ñan project eo.
Katak kin display im display module solutions →