Sɛptɛmba 12, 2024
Bitwin wan sampul we de wok ɛn wan stebul prodakshɔn layn, wan gap de we nɔbɔdi nɔ go ebul fɔ si. Wan payɔt rɔn de fɔ waka krɔs am as smɔl as i pɔsibul.
Di sampul de wok. I de layt, i de du wetin i fɔ du, ɛn bɔku tim dɛn kin bigin fɔ plan volyum. Bɔt rial gap de bitwin sampul ɛn prodakshɔn. Di sampul na tɛknishian we de pik pat dɛn wit in an ɛn ajɔst fayn fayn wan; prodakshɔn na mashin dɛn we de rɔn fɔ takt tɛm. Di sampul na wan yunit; prodakshɔn na tawzin we fɔ mach. Di ɔnsatayniti dɛm we ɛkspiriɛns kwayɛt wan ol dɔŋ na di sampul stej kin kam bak random wans di prɔses de rɔn pan ɔtomɛtik pes.
Wan payɔt rɔn de fɔ waka da gap de fɔ di smɔl mɔni. Di pɔynt fɔ ol na dat, payɔt rɔn nɔto prodakshɔn pan ridyus skel. Wetin fɔ ridyus na kwantiti, nɔto prosidur. Skip wan chɛk ɛn di payɔt na jɔs wan pe rihasal fɔ wan batch fɔ bod dɛn we go nid fɔ wok bak ɛni we. Dɛn 4 chɛk-point ya we de dɔŋ ya na di sikyud we wi plant kin rili ɛksɛkutiv pan smɔl-batch ɔda.
Bifo di layn, rɔn wan manufakchurabiliti rivyu. Di pad dizayn dɛn rayt, aw fɔ opin di stensil aperchɔ dɛn, na kɔmpɔnɛnt ɔriɛnteshɔn dɛn we fayn fɔ put, dɛn dɔn kip tɛst pɔynt dɛn, kliarens de fɔ tru-hol pat dɛn. Ɛni wan pan dɛn tin ya kin tek wan awa fɔ fiks we dɛn de mek am; na di layn i kin min fɔ pul bɔd, kɔt stensil bak, ɔ fɔ skrap wan batch.
DFM in valyu na fɔ translet dizayn intenshɔn to prɔses langwej. Di wan we mek di dizayn bisin bɔt di wok we i de du ɛn di we aw i de wok; di prכsεs εnjinia de kia fכ if dεn kin bil am ripit. We di tu pipul dɛn gɛt di tɔk wan tɛm, bɔku wok we dɛn kin du bak leta nɔ kin ɛva apin. Fɔ smɔl batch dis impɔtant pas ɔl — nɔ volyum de fɔ amortise di kɔst fɔ wok di prɔses aut.
Di fɔs bod we de kɔmɔt na di layn nɔto permishɔn fɔ rɔn. Fɔs-atikul inspekshɔn de chɛk di dimɛnshɔn, sɔlda jɔyn, kɔmpɔnɛnt rɛfrɛns ɛn polariti, ɛn kɔnfɔm se di ikwipmɛnt ɛn program de na kɔrɛkt stet bifo dɛn rilis kɔntinyu prodakshɔn. Dis step de mek wan ol batch nɔ de drɛf, i nɔ de kɔst natin, ɛn i gɛt valyu fɔ bɔku mɔni.
Afta dat, inspekshɔn kin ful-ɔp pas fɔ tek sampul. Ɔl di sɔlda jɔyn dɛn kin go tru ɔtomatik ɔptik inspekshɔn (AOI), ayd jɔyn dɛn lɛk BGA ad X-ray, ɛn flay-prɔb ɛn fɛnshɔnal tɛst usay nid de. Smɔl-batch ɔda dɛn kin gɛt prayz-sɛnsitiv, we kin tɛmpt pipul dɛn fɔ aks if dɛn kin drɔp tɛst — di ɔpɔzit na tru. Smɔl batch nɔ gɛt volyum fɔ skrin wit, so fɔ ful inspekshɔn fɔ kech wan kol jɔyn, i shɔt pas wan kɔstɔma kɔmplen afta dɛn ship am.
Di las get na fɔ pak ɛn inspekshɔn we de kɔmɔt. Afta vijual chɛk de kam OQC, we de kɔnfɔm kwantiti, lɛbɛl, pak we ɛn wan random fɛnshɔnal sampul. At di sem tɛm, di kwɛshɔn dɛn we dɛn fɛn di tɛm we dɛn de rɔn di payɔt kin rayt ɔp: us sɔlda jɔyn dɛn kin kol, usay plesmɛnt ɔfset kin rɔn big, us steshɔn tayt pan takt — ɛn dɛn kɔnklushɔn dɛn de fid stret bak insay prodakshɔn paramita dɛn. if kכnfכmal kכt, ful asembli εn fכnshכnal tεst כl de apin na wan plant, dat fכdbכk lכp de sכt; we dɛn spre akɔdin to sɔm shɔp dɛn, di kɔnklushɔn kin kam afta di pipul dɛn dɔn chenj.
Wi plant de kip sampling, smɔl batch ɛn volyum prodakshɔn na di sem plant, wit payɔt ɛn volyum we di sem pipul dɛn de ɛksɛkutiv agens di sem paramita dɛn. Wetin dat bay nɔto lɔwa freyt kɔst, na unbroken prɔses kɔntɛks — ɛvri anomaly we dɛn fɛn na di payɔt kin bi wan paramita we dɛn sabi na di prodakshɔn layn pas wan ripɔt we nɔbɔdi nɔ rid.
Di 4 chɛk-point dɛn we de na wan payɔl rɔn — fɔs atikul, prɔses paramita winda, yield na di dizayn in wɔs kes, ɛn di ɔpreshɔn-lɛvel fayl rɛkɔd — jɔs de pe if dɛn kɛr di data go bifo. Wan payɔt we kin dɔn wit pas ɛn we dɛn nɔ rayt ɛni nɔmba, nɔ bay natin. Di spɛshal artefakt dɛn we fit fɔ kip na di riflɔ profayl we dɛn rili yuz, di sɔlda paste ɛn inspekshɔn krayteria, di yield we dɛn brok dɔŋ bay fayl mɔd, ɛn di list fɔ dizayn chenj dɛn we di payɔt trigɛt. Dɛn 4 dɔkyumɛnt dɛn de kin bi di prodakshɔn rɛkɔd fɔ di sɛkɔn ɛn tɔd ɔda.
Di ɔda we fɔ du am dia dia we i kin jɔs sho leta. If yu nɔ gɛt di prɔfayl we dɛn dɔn rɛkɔd, wan sɛkɔn bild siks mɔnt ɔf kin sɛt ap frɔm mɛmori ɛn drɛf. If di failure-mode breakdown nɔ de, wan defect we de kam bak kin tan lɛk bad lak instead of pattern. Wi kip payɔt paramita ɛn yield data wit di prɔjek, so ripit ɔda dɛn kin stat frɔm wan dɔkyumɛnt beslayn pas frɔm di ɔpreshɔn in rikɔlɛshɔn.
Prɔblɛm dɛn we kin apin na payɔt kin kɔst bɔku tɛm fɔ rivyu di drɔin ɛn smɔl pat pan wan riwɔk insay volyum. Wans dat aritmɛtik dɔn klia nɔbɔdi nɔ de aks if dɛn kin skip di payɔt. Di rial kwɛshɔn na kɔvarej: fɔs atikul nɔmɔ, ɔ kɔntinyu rɔn lɔng fɔ prodyuz takt ɛn yield data.
Rɔn at le twɛnti to fifti bod dɛn. Tu shɔt rɔn nɔ kin ebul fɔ ɛksplɔz takt prɔblɛm ɔ sho if di fayl dɛn kin ripit. Wetin fɔ wach akɔdin to di rɔn: fɔs atikul rɛkɛd, prɔses paramita lɛk riflɔ profayl, plesmɛnt prɛshɔn ɛn sɔlda durayshɔn, ɛn di kɔz distribyushɔn pan fayl yunit dɛn. Wit dem tri, volyum prodakshon sabi wetin fo difend.
Wan payɔt de mek pipul dɛn ɛn bak di data. Fɔ lɛ di wan dɛn we de wok wit di volyum layn ebul fɔ ol di bod dɛn we dɛn de payɔt, na tin we sef fa fawe pas di fɔs tɛm we dɛn bin de ɛksplɔz dɛn di de we dɛn lanch. Nyu prodak, nyu fiks, nyu prɔses — ɛni wan pan dɛn kin mek tin apin, ɛn fɔ briŋ pipul dɛn insay di prɔses kwik na di inshɔrans we smɔl pas ɔl.
Tɛl wi yu prɔjek sɛnɛriɔ ɛn wetin yu nid, ɛn wi go mach di rayt sɔlvishɔn ɛn gi wi kot insay 24 awa.
Gɛt wan Fri KɔtDi sem faktri de kɔmplit PCBA asɛmbli, SMT patch ɛn THT wɛldin: di mawntin kapasiti we na 95,000 CPH kin aksept 50 injinɛri sɛmpul dɛn bak, ɛn di minim kin mawnt pan 1005/03015 kɔmpɔnɛnt dɛn; matirial dɛn de go tru fɔmal chanɛl dɛn, we de prɔmis ziro fek, ɛn dɛn go jɔs go ɔnlayn afta dɛn pas di inkam matirial inspekshɔn; i gɛt IATF 16949:2016 (TS-1051701), ISO9001 ɛn RoHS Sɛtifiket; pruf, smɔl batch ɛn big kwantiti dɛn de ɛksɛkutiv bay di sem grup fɔ pipul dɛn ɛn akɔdin to di sem sɛt fɔ paramita dɛn.
Lan bɔt ilɛktroniks manufakchurin savis opshɔn dɛn →