Infomesen we klaien i givim; i no stap long wanpela oda stret.
Dispela kampani we i gat FangService i sapotim wok bilong em long go bikpela ovasis, em i save wokim ol sevis bilong wokim ol samting (EMS) bilong ol liklik na namel samting, na i save givim sevis long ol medikel, otomotiv, edvans komyunikesen na IoT aplikesen. Kampani i gat strongpela tingting long inapim ol strongpela kwaliti na teknikel rikwaemen long hai-end ilektroniks prodaksen na long wankain taim em i ken inapim olgeta oda sais. Wantaim wanpela profesenel tim, ol gutpela ikwipmen na planti yia bilong ekspiriens, em i save givim ol gutpela, gutpela ilektronik asembli solusen.
Man we i wokim dispela samting inap long wokim ol liklik samting we i gat bikpela pefomens na yusim 'high-density interconnection' (HDI) teknoloji, na dispela inap long kamapim bikpela 'circuit density' insait long liklik spes tasol.
Em i save tu long wokim ol 'micro-packaging' bilong ol 'wearable' na 'mobile devices', na em i inapim ol strongpela samting bilong mekim i kamap liklik na daunim hevi bilong en.
| Kwaliti Setifiket | ISO9001, IATF16949, ROHS |
|---|---|
| Ol samting bilong wokim samting | Ol solder paste printa, 3D SPI sistem, ol jenerel-pepos na hai-spid plesmen masin, 12-zon naitrojen riflo aven, ol selektiv wev solder masin, 3D AOI sistem, X-rei inspeksen sistem, BGA riwok stesin |
| Prodaksen Kapasiti | Averes 5 milien SMT poin long wan wan de; 'wave soldering' inap long 150,000 hap long wan wan de |
| Ol kain solder | 'Lead-based' na 'lead-free wave soldering'; 'lead-based' na 'lead-free reflow soldering'; solder wantaim; solda long han |
| Ol kain PCB | Ol 'flexible', 'rigid', 'rigid-flex', 'metal-core' na 'high-frequency boards'; ol singel na panelis bod |
| Prodaksen Menesmen | ERP prodaksen menesmen sistem; Valor MSS manufakturing sistem solusen |
| Kwaliti Kontrol | Inspeksen i kam insait; lukluk, AOI na X-re inspeksen; tes bilong ol 'flying-probe', ol 'test fixtures' na 'functional testing'; BGA wok gen |
Dispela 'electronic manufacturing service provider' i bin kamap long mun Epril 2018. Em i kisim sapot long FangService long ovasis ekspansen bilong en. Nau em i gat moa long 150 wokman na wanpela 4,500 m² faktori long No. 209 Golf Road, Dongzhou Sab-distrik, Fuyang Distrik, Hangzhou (Zhonkong Indastrial Pak). Kampani i lukluk long ful-proses PCBA saplai-sen sevis na mid-to-hai-end intelijen manufaksing, na i save givim wan-stop sevis we i karamapim disain na divelopmen, kisim ol samting, ful PCBA proses (SMT/THT/ASSY), warehaus na oda-fulfilmen menesmen. Ol bikpela prodak bilong en em ol ikwipmen bilong toktok, ol sekyuriti ikwipmen, ol indastriel kontrol sistem, ol otomotiv elektroniks, ol stoa divais, ol medikel divais, ol smat mita, ol smat wara pam, ol tul bilong gaden, ol pawa tul na ol IoT divais. Em i kisim luksave olsem wanpela Nesenel Hai-Tek Entaprais na wanpela Zhejiang Provinsal Teknoloji-bes SME, i gat ISO 9001 na IATF 16949 setifikesen na i gat planti peten na sofwet kopirait. Tingting bilong bisnis bilong en: kirapim bisnis long rot bilong gutpela wok, winim long rot bilong kwaliti.
SMT, THT, 'conformal coating' na 'final assembly' olgeta i pinis insait long wanpela 'closed loop' insait long wankain plent.
Dispela plent i stap long Zhonkong Indastrial Pak, Fuyang Distrik, Hangzhou, wantaim 4,500 m² bilong spes long plua.






Ol i kisim poto bilong ol 'circuit-board assembly' na ol samting we ol i wokim pinis long prodaksen lain.






Olgeta ikwipmen i stap long wankain plent; ol namba em ol 'process-capability ratings' we ol kampani i wokim ol ikwipmen i pablisim.
| Solder Paste Printing | Stensil inap long 820×737 mm; PCB 50×50–400×340 mm, tiknes 0.4–6 mm; inap long mekim gen ±0.01 mm; stretpela bilong prinim ±0.025 mm; drai / wet / 'vacuum wiping' |
|---|---|
| SPI Solder Paste Inspeksen | 4-megapiksel kamera; resolusen i go daun long 10–20 µm; ful 3D inspeksen spit 13.7–43.5 cm²/s; painim 01005 komponen; stretpela mak bilong antap 1 µm |
| Hai-Spid Plesmen | Smolpela hap 1005 / 03015; bikpela 55×100 mm; inap long 95,000 CP/H; stretpela ples bilong putim 0.035 mm; inap long 140 'feeder slots' |
| Reflow Soldering | 8–10 ol 'temperature zone'; ples bilong hatim 3,000–3,890 mm; rum tempereja i go long 320 °C; kontrolim stretpela mak ±1 °C; fos-win kol |
| AOI Optical Inspection | 5-megapixel CCD wantaim telecentric lens; ol bod 50×70–400×330 mm; painim ol samting we i no stret, i no stap, i tanim i go bek, i stap longwe, ston bilong matmat, i bruk, kol solda na ol samting bilong narapela kantri |
| Wave Soldering | PCB i go inap long 450 mm; 3-stej hot-ea priheting; rum tempereja i go long 300 °C; 'soldering angle' 4–7°; PLC + 'touchscreen control' |
| Konfomal Koting | Eria bilong karamapim 430×440 mm; tiknes bilong 'coating' 0.02–1 mm; 3-aksis mosen kontrol; indastrial PC + mosen kontrol kad |
| UV Curing | 6 kW UV lait sos; bikpela bilong konveya 50–450 mm; spit 0.5–6 m/min |
Ol dispela setifikesen na ona em kampani i wokim i givim.
Wanem ol kantri na rijon i gat bikpela askim long ol 'Electronic Manufacturing Services'? Go long 'customer development map dashboard' long lukimwok bilong tilim ol kastoma long wol, opainim global prospekt daerektorihia stret long websait bilong FangService.
Yu laikim kampani na ol prodak bilong yu i mas kamap long hia tu, long strongim ovasis ekspansen bilong yu na winim moa intanesenel oda? Wok bung wantaim FangService na amamas long go long wol wantaim!Kontektim mipela.
Salim ol droing o sempel bilong yu i kam long mipela - mipela bai bekim wantaim wanpela gutpela plen bilong wokim na kwotesen insait long 24 aua.
Kisim wanpela fri kwotWanpela-stop ilektronik asembli we i karamapim hariap prototaip, SMT asembli, THT welding, komponen sosing, pinis-prodak asembli na PCB kastomaisesen.
Em i save wok long ol liklik na namel volium prodaksen, na em i save kisim ol 'prototype' na liklik 'batch', na i no gat wanpela 'fixed high minimum order threshold'.
ISO9001, IATF16949 na ROHS setifiket, wantaim lukluk, AOI, X-rei na flai-probe inspeksen long olgeta proses.